The TVZT-3010-03UP utilizes a standard SMD footprint with two metal contacts on the underside for reflow soldering. The compact size allows PCB designers to route traces easily underneath or around the component without crowding the board layout.
The encapsulation resin often contains a diffusing agent to soften the light output, reducing "hot spots" in backlighting applications. The construction is robust, designed to withstand the thermal stresses of lead-free reflow soldering processes. tvzt-3010-03up led
Because manufacturers differ in naming conventions, always confirm with the specific datasheet. Still, this likely describes a tiny surface-mount LED optimized for board-space-limited applications. The TVZT-3010-03UP utilizes a standard SMD footprint with
| Parameter | Value / Description | | :--- | :--- | | Package Type | SMD (Surface Mount Device) – Top View | | Dimensions (LxWxH) | 3.0mm x 1.0mm x 0.8mm (approx.) | | Polarity Marking | Green/White triangle on back or cathode notch | | Soldering Pad | Gold-plated or Silver-plated terminals | | Lens Type | Clear epoxy / Water clear (Highest light extraction) | The construction is robust, designed to withstand the
Do not guess the voltage. Use a Current-Limited Bench Supply to characterize three units.
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